Productos / Pastas / SI-setral-HSC/N

Art.Nr. 020295

SI-setral-HSC/N

Pasta térmica que contiene silicona

5 kg balde


Aplicación

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Esta pasta conductora de calor garantiza un acoplamiento óptimo entre las rugosidades de la superficie del semiconductor y el disipador térmico.

Propiedades

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muy amplia resistencia química
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Compatible con los materiales plásticos habituales
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No tóxico
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Baja separación de aceite
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Sobresaliente conductividad de calor
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Amplio rango de aplicación de temperatura
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estable a oxidación y el envejecimiento
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Económico en el gasto


Datos técnicos
Óptica blanco
Espesante inorgánico
Consistencia 1-2 DIN 51818
Rango de temperatura -40 - +300 °C

All information stated is intended to guide preliminary product selection only. The above information is neither an assurance of product properties nor is it a general statement of fitness for use in the listed applications. Please consult with our technical staff about your specific use case and technical parameters. The information provided on this product page (especially technical (TD) and safety data sheets (MSDS) available in the download section) is intended solely for general information purposes. Updates requires ongoing revisions, which is why we cannot guarantee that the information is always up to date. The legally binding version is the one provided to you at the time of purchase, which applies to the product you recieved. Please compare the documents provided with the downloaded documents before use and contact us if you have any questions.